Recycling Technology for Polyolefin Packaging Film.

CVD diamond thin film technology for MEMS packaging

Due to its extreme hardness, chemical and mechanical stability, large band gap and highest thermal conductivity, poly-crystalline diamond (poly-C) is expected to be an excellent packaging material for biomedical and environmental MEMS devices. A poly-C thin film packaging technology has been developed to explore the application of this novel material on post-MEMS encapsulation packaging process...

Preparation and characterization of a bionanopolymer film for walnut packaging

To apply the nanomaterial as a component in the packaging material structure, in this research, the carboxymethyl cellulose (CMC)/polyvinyl alcohol (PVA) film were prepared with three levels of nanoclay particles (0.5, 1 and 3%) using solution casting evaporation method. The incorporation of nanoclay on mechanical, water vapor permeability, and oxygen barrier properties of CMC/PVA-based film wa...

Preparation and Characterization of a Bionanopolymer Film for Packaging Applications (a Case Study: Walnut Packaging)

The carboxymethyl cellulose (CMC)/polyvinyl alcohol (PVA) film were prepared by adding three levels of nanoclay particles (0.5, 1 and 3%) using solution casting evaporation method. The incorporation of nanoclay on mechanical, water vapor permeability, and oxygen barrier properties of CMC/PVA-based film was investigated. The best result was obtained through the nanocomposite film contain 3% nano...

Poly(ethylene terephthalate) Film Recycling

Modern Electronic Packaging Technology

A view of modern electronic packaging technology is presented along with its applications at APL. Although not always distinct, electronic packaging may be separated into three levels: component, board, and system. The manufacturing technologies and designs may vary at each level, but they all must provide electrical interconnection, thermal management, and mechanical and environmental protecti...